<progress class="gk2npi1uh"></progress>
    <aside class="gk2npi1uh"></aside>

      <aside class="gk2npi1uh"></aside>
          上海SMT贴片加工厂
          您当前的位置 : 首 页 > 简介 > 设备生产能力

          联系我们Contact Us

          利来w66(上海)电子有限公司

          利来w66(上海)电子有限公司

          公司地址:上海市闵行区闵北路288号

          总      机:021-64064840 

          业务电话:18201866769

                          13818505445

          传  真:021-64065245

          网       址:   www.yuluchina.com

          业务邮箱:sales@yuluchina.com


           BGA设备&能力  BGA Equipment & Capability 


          1、BGA工艺制程控制: BGA烘烤、锡膏回温、网板印刷、炉温

          Process control of BGA assembly: Bulk BGA baking, warming-up solder paste, stencil printing, oven temperature.


          2、BGA 最小间距:0.3MM

          Minimum space between components:0.3MM



          SMT 设备能力  SMT Capability


          1、生产线贴装产能:9500万点/月

          SMT line productivity: 95 million points per month


          2、大PCB板尺寸:L = 510MM, W = 460MM

          Maximum size of PCB: L = 510MM, W = 460MM


          3、最小PCB板尺寸:L = 50MM, W = 30MM

          Minimum size of PCB: L = 50MM, W = 30MM


          4、贴片PCB板厚度:0.4MM - 4MM (1-12层)

          Thickness of PCB: 0.4MM - 4MM (1-12 layers)


          5、贴片最小尺寸:0201 (0.6*0.3MM)

          Minimum component size for SMT: 0201 (0.6*0.3MM)


          6、贴片大异型:33.5*33.5MM

          Maximum component size for SMT: 33.5*33.5MM


          7、芯片最小间距:0.2MM

          Minimum space between components:0.2MM